Abstract
Conference Title: 2015 Asia-Pacific Microwave Conference (APMC) Conference Start Date: 2015, Dec. 6 Conference End Date: 2015, Dec. 9 Conference Location: Nanjing, China This paper presents our developed dual-chip wireless communication solution adhering to the IEEE 802.11ad standards. The solution is based on a fully integrated baseband IC (BBIC) embedded with USB3.0 interfaces and a low power 60 GHz transceiver SOC (RFIC) embedded inside an antenna in packaging system. The BBIC uses frequency domain equalizer and preambles to perform synchronization, automatic gain control, estimation and compensation for better system performance. A low power 60GHz RFIC using a sub-harmonic sliding-IF scheme is fully integrated based on low cost SiGe 0.18 um BiCMOS process.