Abstract
The formation and thermal stability of Ni- and Ni(Pt) silicide on narrow polycrystalline Si (poly-Si) lines have been investigated using the non-destructive micro-Raman technique. The presence of Ni or Ni(Pt)Si on poly-Si lines with linewidths ranging from 0.5 mu m to 0.25 mu m has been monitored by a distinct Raman peak at around 215 cm(-1). Ni(Pt)Si was clearly identified to be present up to a RTA temperature of 900 degrees C on narrow poly-Si lines as compared to pure NiSi which was found only up to 750 degrees C. Raman scattering from the 100x100 mu m(2) poly-Si pads showed the formation of NiSi2 at 750 degrees C for pure Ni-salicidation and 900 degrees C for Ni(Pt)salicidation respectively. The difference in the stability of NiSi on the poly-Si pads and lines is discussed in terms of agglomeration, inversion and/or nucleation of NiSi2 that could be due to difference in nucleation sites and/or stress. In addition, a correlation between the line sheet resistance and the presence of Ni silicide was found using micro-Raman mapping along single poly-Si lines.