Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects

Conference proceeding

Peer reviewed

L. W Chu, W. K Chim, K. L Pey, J. Y. K Yeo and L Chan

Journal of electronic materials, Vol.30(12), pp.1513-1519

01/12/2001

Abstract

Applied sciences

Electronic equipment and fabrication. Passive components, printed wiring boards, connectics

Electronics

Exact sciences and technology

1 Record Views

Title: Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
Creators - without role: L. W Chu - ON Semiconductor (United States)
W. K Chim - National University of Singapore
K. L Pey - Duke-NUS Medical School
J. Y. K Yeo - Chartered Semiconductor Manufacturing Ltd., 4 Engineering Drive 3, Singapore 738406, Singapore
L Chan - Chartered Semiconductor Manufacturing Ltd., 4 Engineering Drive 3, Singapore 738406, Singapore
Publication Details: Journal of electronic materials, Vol.30(12), pp.1513-1519
Publisher: Institute of Electrical and Electronics Engineers
Number of pages: 7
Identifiers: 9914324309846
Academic Unit: Engineering Product Development (EPD); Temasek Lab
Language: English
Resource Type: Conference proceeding