Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees

Conference proceeding

C. L. Thompson Gan and Kin Leong Pey

IEEE International Reliability Physics Symposium 2002, (41ST), pp.594-595

2003

Abstract

reliability physics IEEE electron devices

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Title: Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees
Creators - without role: C. L. Thompson Gan
Kin Leong Pey - Temasek Lab
Publication Details: IEEE International Reliability Physics Symposium 2002, (41ST), pp.594-595
Publisher: IEEE; 2003
Identifiers: 9914222509846
Academic Unit: Engineering Product Development (EPD); Temasek Lab
Language: English
Resource Type: Conference proceeding