Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees

Conference proceeding

C. L Gan, C. V Thompson, K. L Pey, W. K Choi, C. W Chang and Q Guo

Materials Research Society symposia proceedings, Vol.766, pp.121-126

2003

Abstract

advanced interconnects

dielectrics

interconnects

low-K dielectrics

materials research

Mrs.

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Title: Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees
Creators - without role: C. L Gan
C. V Thompson
K. L Pey
W. K Choi
C. W Chang
Q Guo
Publication Details: Materials Research Society symposia proceedings, Vol.766, pp.121-126
Publisher: MRS; 2003
Identifiers: 9914230609846
Academic Unit: Engineering Product Development (EPD); Temasek Lab
Language: English
Resource Type: Conference proceeding