Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

Conference proceeding

C. L. Thompson Gan and Kin Leong Pey

Materials Research Society symposia proceedings, Vol.716, pp.431-438

2002

Abstract

silicon materials materials research MRS

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Title: Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees
Creators - without role: C. L. Thompson Gan
Kin Leong Pey - Temasek Lab
Publication Details: Materials Research Society symposia proceedings, Vol.716, pp.431-438
Publisher: Warrendale, PA; Materials Research Society; 2002
Identifiers: 9914330309846
Academic Unit: Engineering Product Development (EPD); Temasek Lab
Language: English
Resource Type: Conference proceeding