Inter-die fabrication uniformity of silicon photonic fiber-towaveguide edge couplers

Jun Rong Ong; Thomas Ang; Tina X. Guo; Ezgi Sahin; Soon Thor Lim; D. T. H. Tan; Wang Hong; Ching Eng Png; IEEE; Tse Hui Dawn Tan

doi:10.1364/OFC.2018.Th2A.11

Conference proceeding

Inter-die fabrication uniformity of silicon photonic fiber-towaveguide edge couplers

Jun Rong Ong, Thomas Ang, Tina X. Guo, Ezgi Sahin, Soon Thor Lim, D. T. H. Tan, Wang Hong, Ching Eng Png, IEEE and Tse Hui Dawn Tan

2018 Optical Fiber Communications Conference and Exposition (OFC), Vol.2018

01/01/2018

DOI: https://doi.org/10.1364/OFC.2018.Th2A.11

Abstract

Engineering

Engineering, Electrical & Electronic

Optics

Physical Sciences

Science & Technology

Technology

Telecommunications

Silicon-on-insulator fiber-to-waveguide inverse taper edge couplers of different tip widths of 120nm to 200nm are fabricated using a multi-project wafer service. The coupling efficiencies and the inter-die fabrication uniformity of the edge couplers are compared.

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Title: Inter-die fabrication uniformity of silicon photonic fiber-towaveguide edge couplers
Creators - without role: Jun Rong Ong - Institute of High Performance Computing
Thomas Ang - ITER
Tina X. Guo - Nanyang Technological University
Ezgi Sahin - Singapore University of Technology and Design
Soon Thor Lim - Institute of High Performance Computing
D. T. H. Tan - Singapore University of Technology and Design
Wang Hong - Nanyang Technological University
Ching Eng Png - Institute of High Performance Computing
IEEE
Tse Hui Dawn Tan - EPD Pillar
Publication Details: 2018 Optical Fiber Communications Conference and Exposition (OFC), Vol.2018
Publisher: IEEE
Number of pages: 3
Identifiers: 9911315309846
Academic Unit: EPD Pillar
Language: English
Resource Type: Conference proceeding

Inter-die fabrication uniformity of silicon photonic fiber-towaveguide edge couplers

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