Abstract
In this research, UNS C18400 copper alloy was selected for the Selective Laser Melting (SLM) process. C18400 is a thermally precipitation hardenable copper alloy with good thermal and electrical conductivity. SLM C18400 samples with relative density of 96.74% were produced using a uniform laser beam with laser power 800 W, scan speed 600 mm/s, hatch spacing 0.1 mm, layer thickness 0.05 mm and base plate preheating of 100 degrees C. The microstructure was characterised and its forming process was investigated. A part with thin wall features of varying wall thicknesses (from 0.4 mm to 3 mm) was produced under proper forming parameters. The densification behaviour and microstructure were also addressed.