Abstract
A method for surface metallization on transparent substrate with laser induced plasma deposition was described. A laser beam goes through the transparent substrate first and then irradiates on a metal target behind. For laser fluence above ablation threshold for the target, the generated plasma flies forward at a high speed to the substrate and induces metal materials deposition on its rear side surface and even doping into the substrate. The diffusion distribution of metallic particles was measured with Time of Flight Secondary Ion Mass Spectrometer (TOF-SIMS). Electrically conducting films are formed on the substrate with laser beam scanning. The near 1 /Square lower resistivity can be formed with precise control of the processing parameters. Laser fluence, pulse repetition rate and scanning speed, distance between the substrate and metal target and overlapping of the metal lines. This technology can be used to form electrodes, resistors, LCD or electronic circuits on the transparent substrates.