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Silicon Based MM Wave IC Design for 60 GHz and Beyond
Conference proceeding

Silicon Based MM Wave IC Design for 60 GHz and Beyond

Kaixue Ma, Fanyi Meng, Shouxian Mou, Kiat Seng Yeo and IEEE
2017 10TH UK-EUROPE-CHINA WORKSHOP ON MILLIMETRE WAVES AND TERAHERTZ TECHNOLOGIES (UCMMT)
UK Europe China Millimeter Waves and THz Technology Workshop
01/01/2017

Abstract

Engineering Engineering, Electrical & Electronic Science & Technology Technology Telecommunications
This paper briefly presents a 60-GHz dual-chip wireless communication solution adhering to the IEEE 802.11 ad standards. The proposed fully-integrated transceiver front-end chip (RFIC) using a sub-harmonic sliding-IF scheme to reduce the design difficulty on VCO, was implemented based on a low cost SiGe 0.18um BiCMOS process and has a compact chip area of 5mm by 3.9mm with a low power consumption of 218mW for TX mode and 261mW for Rx mode. The baseband IC (BBIC) uses adaptive time domain equalizer to perform synchronization, automatic gain control and to lower the chip size and power consumption.

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