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Stackable resistive memory device using photo cross-linkable copolymer
Conference proceeding

Stackable resistive memory device using photo cross-linkable copolymer

Wei Lek Kwan, Ricky J. Tseng, Wei Wu, Qibing Pei, Yang Yang and IEEE
2007 IEEE International Electron Devices Meeting, pp.237-240
IEEE International Electron Devices Meeting
01/01/2007

Abstract

Engineering Engineering, Electrical & Electronic Engineering, Multidisciplinary Science & Technology Technology
A multi-stackable memory device was fabricated using a photo cross-linkable copolymer. Once cross-linked, the polymer film became insoluble, making multi-level stacking possible. It can also be directly patterned using a photomask, reducing the numbers of processing steps. The memory device consisted of a polymer film sandwiched between two electrodes. The device could be switched from a high resistive state to a low resistive state using 4 V pulse, and back to its high resistive state using a 9 V pulse. Our device showed stable performance achieving more than 4000 times of write/erase cycles.

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