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The effects of dielectric slots on Copper/Low-k interconnects reliability
Conference proceeding

The effects of dielectric slots on Copper/Low-k interconnects reliability

A. Heryanto, Y.K. Lim, K.L. Pey, W. Liu, J.B. Tan, D.K. Sohn, L.C. Hsia and IEEE
2009 IEEE International Interconnect Technology Conference, pp.92-94
06/2009
DOI: https://doi.org/10.1109/IITC.2009.5090349

Abstract

Copper Current density Dielectrics Electromigration Failure analysis Grain boundaries Grain size Morphology Reservoirs Testing
The effects of dielectric slots on Cu/Low-k interconnects reliability were studied. Dielectric slots were proven to be effective in suppressing stress-induced void failure but their impact on EM reliability was found to be minimal. Physical failure analysis and finite element simulations were used to explain the possible mechanisms associated to the different effects of dielectric slots on Cu/low-k reliability.

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