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WIDEBAND SOUND ABSORPTION 3D PRINTED MULTI-LAYER MICRO-PERFORATED PANELS
Conference proceeding

WIDEBAND SOUND ABSORPTION 3D PRINTED MULTI-LAYER MICRO-PERFORATED PANELS

Wenjing Yang, Shangqin Yuan, Chee Kai Chua and Kin Zhou
PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON PROGRESS IN ADDITIVE MANUFACTURING, pp.370-375
Proceedings of the International Conference on Progress in Additive Manufacturing
01/01/2018

Abstract

Engineering Engineering, Biomedical Engineering, Manufacturing Science & Technology Technology
Micro-perforated panel (MPP) absorbers have been applied widely in noise reduction and sound damping. In order to obtain wideband sound absorption, novel structures of MPPs with various numbers of panel layers and spacing distances between them were designed. The structures were manufactured by selective laser sintering, which is an advanced 3D printing technique producing complex structures effectively. The sound absorption coefficients of MPPs were measured by the impedance tube method. The results suggested that the multi-layer structures significantly increased the bandwidths of the absorption compared to the single-layer MPPs. This research work demonstrates the large potential of artificial acoustic designs of MPP via 3D printing for wideband absorption through controlling the layer number and the spacing distance.

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