8.1 Novel Dielectric Slots in Cu Interconnects for Suppressing Stress-Induced Void Failure

Journal article

Y. K Lim, K. L Pey, J. B Tan, T. J Lee, D Vigar, L. C Hsia, Y. H Lim and N. R Kamat

Technical digest - International Electron Devices Meeting, pp.187-190

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Title: 8.1 Novel Dielectric Slots in Cu Interconnects for Suppressing Stress-Induced Void Failure
Creators - without role: Y. K Lim
K. L Pey
J. B Tan
T. J Lee
D Vigar
L. C Hsia
Y. H Lim
N. R Kamat
Publication Details: Technical digest - International Electron Devices Meeting, pp.187-190
Publisher: IEEE; 1998
Identifiers: 9914322209846
Academic Unit: Engineering Product Development (EPD); Temasek Lab
Language: English
Resource Type: Journal article