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A Comparison of the Selective Etching Characteristics of Conventional and Low-Temperature-Grown GaAs over AlAs by Various Etching Solutions
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A Comparison of the Selective Etching Characteristics of Conventional and Low-Temperature-Grown GaAs over AlAs by Various Etching Solutions

Rong Zhao, Wai Shing Lau, Tow Chong Chong Tow Chong Chong, Ming Fu Li Ming Fu Li and Tow Chong Chong
Japanese Journal of Applied Physics, Vol.35(1R), pp.22-25
01/01/1996

Abstract

In this work we report the selective etching characteristics of GaAs grown by molecular beam epitaxy over AlAs etch-stop layer in four etching solutions. We show that these solutions, which are commonly used for selective etching of GaAs grown at the conventional temperature of 600° C (HT GaAs) are also effective for low-temperature GaAs grown at 230° C with annealing at 600° C (a-LT GaAs) and low-temperature-grown GaAs without annealing (LT GaAs). In these solutions, the etching rates of LT GaAs and a-LT GaAs are lower than that of HT GaAs and hence the selectivities of LT GaAs and a-LT GaAs over AlAs are lower than that of HT GaAs over AlAs. The succinic acid/ H 2 O 2 solution with pH=4.2 was found to be the best selective etchant. Furthermore, we observed, for the first time, that the AlAs etch-stop layer tended to fail at the periphery of the etched windows, resulting in void formation if the etching was excessive. It took a longer time for this to happen in the succinic acid/ H 2 O 2 solution than in other solutions investigated.

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