Characterization and modeling of on-wafer single and multiple vias for CMOS RFICS

Journal article

Open access

Peer reviewed

Xiaomeng Shi, Kiat Seng Yeo, Manh Anh Do, Chirn Chye Boon and Kiat Seng Yeo

Microwave and optical technology letters, Vol.50(3), pp.713-715

03/2008

Abstract

equivalent circuit model

on-wafer vias

RF CMOS

url

https://doi.org/10.1002/mop.23173View

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Title: Characterization and modeling of on-wafer single and multiple vias for CMOS RFICS
Creators - without role: Xiaomeng Shi - Nanyang Technological University
Kiat Seng Yeo - Nanyang Technological University
Manh Anh Do - Nanyang Technological University
Chirn Chye Boon - Nanyang Technological University
Kiat Seng Yeo - Office of Provost
Publication Details: Microwave and optical technology letters, Vol.50(3), pp.713-715
Publisher: Wiley Subscription Services, Inc., A Wiley Company
Number of pages: 3
Identifiers: 9912508209846
Academic Unit: Office of Provost
Language: English
Resource Type: Journal article