Coefficient of thermal expansion for solder alloys based on cluster expansion method

Journal article

Peer reviewed

HONG MEI Jin and Ping WU

Journal of materials chemistry, Vol.12(4), pp.1090-1093

21/03/2002

Abstract

Applied sciences

Condensed matter: structure, mechanical and thermal properties

Exact sciences and technology

Metals. Metallurgy

Physics

Thermal expansion; thermomechanical effects

Thermal expansion; thermomechanical effects and density

Thermal properties of condensed matter

Thermal properties of crystalline solids

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Title: Coefficient of thermal expansion for solder alloys based on cluster expansion method
Creators - without role: HONG MEI Jin - Singapore Science Park
Ping WU - Singapore Science Park
Publication Details: Journal of materials chemistry, Vol.12(4), pp.1090-1093
Publisher: Royal Society of Chemistry
Number of pages: 4
Identifiers: 9912691909846
Academic Unit: EPD Pillar
Language: English
Resource Type: Journal article