Correlation between bulk modulus of ternary intermetallic compounds and atomic properties of their constituent elements

Journal article

Peer reviewed

Chonghe Li, Yen Li Chin and Ping Wu

Intermetallics, Vol.12(1), pp.103-109

01/2004

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Title: Correlation between bulk modulus of ternary intermetallic compounds and atomic properties of their constituent elements
Creators - without role: Chonghe Li - Institute of High Performance Computing
Yen Li Chin - National University of Singapore
Ping Wu - Institute of High Performance Computing
Publication Details: Intermetallics, Vol.12(1), pp.103-109
Number of pages: 7
Identifiers: 9912784109846
Academic Unit: EPD Pillar
Language: English
Resource Type: Journal article