Abstract
A novel interconnect model is used in the postlayout simulation of a broadband transimpedance amplifier. Simulation results employing the proposed model are verified by on-wafer measurement results. The impact of interconnect effects on the circuit performance is analyzed. The importance of incorporating an adequate interconnect model is demonstrated. (C) 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 3017-3020, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23878