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Impact of Buffer Layer on Atomic Layer Deposited TiAlO Alloy Dielectric Quality for Epitaxial-GaAs/Ge Device Application
Journal article   Peer reviewed

Impact of Buffer Layer on Atomic Layer Deposited TiAlO Alloy Dielectric Quality for Epitaxial-GaAs/Ge Device Application

G. K. Dalapati, C. K. Chia, C. Mahata, S. Krishnamoorthy, C. C. Tan, H. R. Tan, C. K. Maiti and Dongzhi Chi
IEEE transactions on electron devices, Vol.60(1), pp.192-199
01/2013

Abstract

Atomic layer deposition (ALD) Buffer layers Dielectrics epitaxial gallium-arsenide (epi-GaAs) MOS Gallium arsenide Logic gates Rough surfaces Substrates Surface roughness TiAlO alloy high- kappa dielectric
The impact of AlGaAs and AlAs buffer layers on the electrical properties of an epitaxial gallium-arsenide (epi-GaAs) metal-oxide-semiconductor capacitor (MOSC) was investigated. MOSC was fabricated by using atomic-layer-deposited Al 2 O 3 -TiO 2 (TiAlO) alloy gate dielectric and epi-GaAs layers. The epi-GaAs layer was grown on Ge substrates at 675 ° C with and without buffer layer between epi-GaAs layer and Ge substrates. The TiAlO/epi-GaAs interface with an AlGaAs buffer layer allows realizing a high-quality interface between epi-GaAs layers and TiAlO dielectric, much sought after for high-speed transistor applications on a silicon platform. TiAlO dielectric is amorphous even upon annealing at 500 ° C and exhibits a sharp interface with epi-GaAs layers. The choice of AlGaAs over AlAs for a buffer layer was made based on the quality of resulting TiAlO/epi-GaAs surface passivation as evident through structural and electrical characteristics. Epi-GaAs with an AlGaAs buffer layer was found to improve the performance of the MOSC significantly through increase in accumulation capacitance and breakdown voltage. The interface state density, flatband voltage, frequency dispersion, and leakage current were decreased for the MOSC fabricated with an AlGaAs buffer layer.

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