Abstract
Laser beam has found its more extensive applications in microelectronics industry based on the advantages of low cost, non-contact and fast speed microfabrication. In this paper, laser singulation to separate wafer and multi-layer device structures is studied. It shows that laser can achieve superior cutting quality challenged to mechanical dicing saw with the proper tuning of laser processing parameters. Heat induced crack during the laser irradiation is discussed. Critical issues which are limiting laser application to singulation, such as surface contamination, laser power and balance between cutting speed & edge quality are investigated. It is found that laser singulation can find its niche area over saw dicing to separate thin wafers & difficult processed substrates with special designed approaches. Techniques on pocket scanning and dual laser beam irradiation are developed for multi-layer devices.