Abstract
Multi-layer stackable polymer memory architecture is an interesting new direction for polymer memory. The memory density can be increased by increasing the number of stacked layers without reducing the minimum feature size. To achieve multi-level stacking, the polymer used must be able to be cross-linked so that it will not be dissolved upon deposition of additional layers. This requirement also makes the polymer robust enough to withstand conventional lithographic processes. In this paper, the various approaches to achieve cross-linkable polymer memory are discussed. Device fabrication and performance are also reported.