Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition (vol 91, 254105, 2007)

Journal article

Peer reviewed

Di Xu, Wei Lek Kwan, Kai Chen, Xi Zhang, Vidvuds Ozolins and King-Ning Tu

Applied physics letters, Vol.97(12), 129904

20/09/2010

Abstract

Physical Sciences

Physics

Physics, Applied

Science & Technology

url

https://doi.org/10.1063/1.3489689View

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Title: Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition (vol 91, 254105, 2007)
Creators - without role: Di Xu - University of California, Los Angeles
Wei Lek Kwan - University of California, Los Angeles
Kai Chen - University of California, Los Angeles
Xi Zhang - University of California, Los Angeles
Vidvuds Ozolins - University of California, Los Angeles
King-Ning Tu - University of California, Los Angeles
Publication Details: Applied physics letters, Vol.97(12), 129904
Publisher: Amer Inst Physics
Number of pages: 1
Identifiers: 9912379809846
Academic Unit: SCI,MATH & Technology
Language: English
Resource Type: Journal article