Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress

Journal article

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Nagarajan Raghavan, Andrea Padovani, Xiang Li, Xing Wu, Vui Lip Lo, Michel Bosman, Luca Larcher and Kin Leong Pey

Journal of applied physics, Vol.114(9), 094504

07/09/2013

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Title: Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress
Creators - without role: Nagarajan Raghavan - Nanyang Technological University
Andrea Padovani - University of Modena and Reggio Emilia
Xiang Li - Singapore Science Park
Xing Wu - Singapore University of Technology and Design
Vui Lip Lo - GLOBALFOUNDRIES, Woodlands Industrial Park D, Singapore
Michel Bosman - Agency for Science, Technology and Research
Luca Larcher - University of Modena and Reggio Emilia
Kin Leong Pey - Singapore University of Technology Design (SUTD), Singapore
Publication Details: Journal of applied physics, Vol.114(9), 094504
Identifiers: 9912362109846
Academic Unit: Engineering Product Development (EPD)
Language: English
Resource Type: Journal article