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Sputter-Deposited La2O3 on p-GaAs for Gate Dielectric Applications
Journal article   Peer reviewed

Sputter-Deposited La2O3 on p-GaAs for Gate Dielectric Applications

T. Das, C. Mahata, C. K. Maiti, G. K. Dalapati, C. K. Chia, D. Z. Chi, S. Y. Chiam, H. L. Seng, C. C. Tan, H. K. Hui, …
Journal of the Electrochemical Society, Vol.159(2), pp.G15-G22
01/01/2012

Abstract

Electrochemistry Materials Science Materials Science, Coatings & Films Physical Sciences Science & Technology Technology
The interfacial and electrical properties of RF sputtered La2O3 on p-GaAs substrates with and without ultrathin Si interface passivation layer (IPL) are reported. X-ray photoelectron spectroscopy (XPS) studies revealed the formation of thermally stable interfacial native oxide (Ga-oxide and As-oxide) for La2O3/Si/p-GaAs gate stacks. The presence of (La2O3)(1-x)(SiO2)(x) at the interface prevented the formation of La-hydroxide which improved the metal-oxide-semiconductor (MOS) device characteristics, such as interface state density (similar to 1.2x10(12)eV(-1)cm(-2)), frequency dispersion (similar to 7%), and hysteresis voltage (similar to 260 mV). A gate leakage current density of 1.1x10(-5) A.cm(-2) has been achieved at V-fb-1 V for an equivalent oxide thickness of 3.4 nm and small flat-band voltage instability under constant voltage stressing was observed. The electrical properties of Al/La2O3/Si/p-GaAs MOS capacitors were found to improve after post deposition annealing at 500 degrees C. (C) 2011 The Electrochemical Society. [DOI: 10.1149/2.072202jes] All rights reserved.
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https://doi.org/10.1149/2.072202jesView
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