Theoretical estimation of coefficient of thermal expansion for solder alloy

Journal article

Peer reviewed

Boon Kwang Lee, Hong Mei Jin and Ping Wu

Journal of materials science, Vol.38(6), pp.1135-1137

15/03/2003

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Title: Theoretical estimation of coefficient of thermal expansion for solder alloy
Creators - without role: Boon Kwang Lee - National University of Singapore
Hong Mei Jin - Singapore Science Park
Ping Wu - National University of Singapore
Publication Details: Journal of materials science, Vol.38(6), pp.1135-1137
Number of pages: 3
Identifiers: 9912791209846
Academic Unit: EPD Pillar
Language: English
Resource Type: Journal article